Interconnection Technologies

Lötstelle Runddraht auf einer Solarzellenoberfläche.
© Fraunhofer ISE
Solder joint round wire on a solar cell surface.
Querschliff eines Runddrahts.
© Fraunhofer ISE
Cross-section of a round wire.

The development and continuous optimization of new solar cell technologies and solar cell formats (TOPCon, SHJ, Tandem) is leading to an increasing number of busbar structures on solar cells and the use of shingle technology. In addition, new high-efficiency technologies require joining methods with low process temperatures. Examples of this are conductive bonding or soft soldering with solder alloys with a lower melting point than the tin-lead solder mainly used in photovoltaics. The use of round wires in comparison to conventional cell connectors makes it possible to reduce electrical and optical losses. By increasing the number of round wires per cell, a lower series resistance is achieved and the optimized light scattering of the round wire back onto the solar cell allows a higher module output to be achieved.

The round wires consist of a copper core with a diameter of 200 µm to 400 µm and are coated with a lead-free or lead-containing solder. As with the interconnection of solar cells with conventional cell connectors with a rectangular cross-section, the round wires are fixed to the solar cells using soft soldering or conductive adhesive to connect the cells. One challenge in interconnection technology for solar cells is the occurrence of thermomechanical stresses, which can lead to microcracks in solar cells and limit the service life of PV modules.

At Fraunhofer ISE, we are working on the development of corrugated wires that reduce the thermomechanical stresses and enable a busbar-free interconnection of the contact fingers or the low-stress interconnection of back-contact solar cells. Furthermore, an optimized area utilization in the PV module is being analyzed by reducing the cell spacing up to the cell overlap. The focus here is on the requirements of the round wire in the transition area of the cells and the mechanical loads that act on the cell edges.  

We are also working on shingle technology, electrically conductive bonding of high-efficiency solar cells and lead-free soldering for RoHS-compliant solar cell interconnection.

R&D-Services

Our Services on the Topic "Interconnection Technology" Include:

  • In-house test days to evaluate materials and processes
  • Production of wire strings with multi-wire technology and SmartWireConnection Technology (SWCT™), with individual cell spacing and string length
  • Production and testing of prototype modules and small series
  • Customer and material-specific process developments for soldering processes and conductive adhesive joints. Temperatures, process times and throughput are adapted for optimum joining results.
  • Evaluation of different solders, e.g. for a lead-free interconnection with round wires
  • Detailed characterization of the joints Listing and linking to the sections of the following R&D services
  • Characterization of wires: Tensile tests and microstructure investigations on micrographs
  • Stability of the joints: Analysis, for example through mechanical adhesion tests, electrical measurements, X-ray inspection, microstructure examinations on ground joints, as well as accelerated temperature cycle tests at module level
  • Stringer for Wire Connections:

  • Multi-wire/busbar technology with 9, 10, 12 wires for half cells (cell formats M6, M10, M12)
  • SmartWire Connection Technology (SWCTTM), especially for heterojunction solar cells
  • Conductive bonding with round wires (cell formats up to M6)

More Information on this Research Topic

 

Shirkan 2

Matrix Shingle Technology for the Future of Photovoltaics

 

KoMoGER

Competitive Modules "Made in Germany"

 

Oxford PV and Fraunhofer ISE Develop Full-sized Tandem PV Module with Record Efficiency of 25 Percent

Contact

Achim Kraft

Contact Press / Media

Dr. Achim Kraft

Interconnection Technologies

Fraunhofer ISE
Heidenhofstr. 2
79110 Freiburg

Phone +49 761 4588-5544

Benjamin Grübel

Contact Press / Media

Dr.-Ing. Benjamin Grübel

Soldering

Fraunhofer ISE
Heidenhofstr. 2
79110 Freiburg

Phone +49 761 4588-2580

Torsten Rößler

Contact Press / Media

Dr. Torsten Rößler

Conductive Bonding

Fraunhofer ISE
Heidenhofstr. 2
79110 Freiburg

Phone +49 761 4588-5023