When implementing new and existing concepts, mechanical and thermal design is crucial to their success. Owing to the high concentration factors involved, it must be possible to transfer heat flux of between 30 and over 100 W/cm² from the cell to the substrate.
With the aid of thermomechanical F(inite)E(lement)M(ethod) simulations, we are able to predict temperatures and thermal deformations in the components. C(omputational)F(luid)D(ynamics) simulations enable us to analyze heat transfer within modules as well as between modules and the surrounding environment.