
Automated packaging of laser power converters: A wire bonder creates the electrical contact of the photovoltaic cell to the Transistor Outline (TO) header.
At ConTEC (Concentrator Technology & Evaluation Center), we develop manufacturing processes for the automated mounting of laser power converters. In our laboratories we use industry-level packaging equipment. This enables us to develop processes with high through-put. For quality assurance, we characterize the assemblies or modules in-line or off-line.
The equipment at ConTEC is used for pilot or small series production. The mounting is carried out on a Transistor Outline (TO) header (TO-46, TO-39) or on planar copper or ceramic substrates which can be individually customized.