Cell Interconnection and Encapsulation

© Fraunhofer ISE

Cell connection and encapsulation are the key processes of the module production. Our areas of work include:

  • Qualifying cells with new metallization
  • Back-contact technology, such as Metal Wrap Trough (MWT)
  • Reducing thermo-mechanical stress
  • Innovative cell connectors and connection designs
  • Heavy metal solders and bonding technology
  • Process control
  • Testing new encapsulation materials