Fraunhofer Institute for Solar Energy Systems ISE
While modern ultrashort pulse lasers achieve unprecedented power levels, unlocking their full potential for industrial applications requires advances in beam delivery and process automation. Traditional systems face critical bottlenecks in scan speeds, positioning accuracy, and thermal management – particularly when processing large-area substrates.
We’ve pioneered a dynamic processing architecture combining polygon scanners (>1 km/s scan speeds), real-time workpiece tracking, and adaptive beam control to achieve eight times faster than conventional galvanometer systems.
Our key innovations:
- Large-field processing with >200mm scan fields at <10 μm spot sizes, Wafer-scale uniformity <2% variation across 210 mm substrates
- Synchronized NIR/UV ultrashort pulses for contact opening speeds exceeding 500,000 holes/second
This platform has demonstrated record-breaking performance in photovoltaic manufacturing, including 15,000 wafers/hour processing rates for PERC solar cells.
For functional surface modifications, we also integrate DLIP (Direct Laser Interference Patterning) with high-energy pulsed lasers to create periodic structures. This capability enables cost-effective production of anti-reflective, self-cleaning, or tribologically optimized surfaces.
Our solutions bridge the gap between lab-scale R&D and full production:
- Modular tool designs compatible with roll-to-roll and conveyor systems
- Sensor and actuator integration for on-the-fly workpiece detection, workpiece tracking and process control
Our R&D services include:
- Leveraging high power ultrashort pulse lasers for your industrial application
- Demonstrate how to accelerate your laser application with high-speed scanning
- Custom sensor integration to ensure precision and efficiency for on-the-fly laser processing
