Laser Processing of Transparent Materials

Processing transparent hard materials like silicon carbide (SiC), sapphire, and glass presents challenges due to their exceptional hardness, brittleness, and unique optical properties. Silicon carbide and sapphire, for example, traditionally demand expensive diamond tooling with limited lifespans. Glass processing faces significant issues with thermal management, crack formation, and maintaining optical properties. These materials resist conventional machining techniques, often resulting in compromised structural integrity, poor surface quality or inefficient processing.

At Fraunhofer ISE we specialize in advanced laser processing techniques for transparent hard materials. We utilize high-power ultrashort pulse lasers, spanning from UV to NIR wavelengths, couples with fast scanners for rapid, precise cutting. Our expertise extends to high-NA scribing of dielectric and wide-bandgap materials, enabling intricate patterning and modification. We conduct in-depth nonlinear absorption studies and employ in-situ process control for optimal results. Our capabilities also include in-volume scribing and directed sub-surface crack propagation, allowing for internal modifications without surface damage. Additionally, we are developing surface patterning and laser-assisted etching techniques, particularly in creating anti-glare glass surfaces for PV applications.

Our R&D Services for the Glass and Semiconductor Industries:

• Intricate patterning and modification of dielectric and wide-bandgap materials
• Individual solutions for laser processes incorporating cutting-edge technologies, such as Thermal Laser Separation (TLS™)
• Large-scale manufacturing solutions in the field of transparent hard material laser processing
• Development of surface patterning and laser-assisted etching techniques
• In-depth nonlinear absorption studies