Interconnection and Encapsulation of Tandem Solar Cells
At Fraunhofer ISE we are researching and developing reliable solutions for the interconnection and encapsulation of silicon perovskite tandem and III-V silicon tandem solar cells. Due to the different characteristics of tandem solar cells, the conventional interconnection and encapsulation processes used for c-Si solar cells cannot be transferred one-to-one to the different tandem technologies. For example, silicon perovskite tandem solar cells are particularly sensitive to humidity, temperature and mechanical stress. III-V/silicon tandem solar cells are thin and flexible. Fraunhofer ISE is thus developing various interconnection processes such as shingling for silicon III/V tandem solar cells. This allows the minimization of cell-to-module losses, making very high module efficiencies possible. Our development work is accompanied by an in-depth characterization based on simulations and measurements.