Module Analysis and Reliability

In the Research Topic "Module Analysis and Reliability", we investigate the long-term stability and performance of PV modules as well as their materials and individual components. We act as a link between module development, production and practical application in the field.   

Our support for module manufacturers includes the identification of reliable components, the development of quality assurance procedures and comprehensive product tests to ensure the usability of innovative products.  

We help system developers and operators to identify suitable module technologies and analyze the causes and effects of module damage from practical applications. In addition, we develop test methods and degradation models that enable us to estimate and identify ageing behavior and risks at an early stage. Our focus here is on integrated photovoltaic applications with their specific load profiles. 

Fields of Work

In the research topic "Module Analysis and Reliability" we focus on the following fields of work:

Reliability of PV Modules

Calibration and Characterization

Root Cause Analysis

Analysis of Modules and Components

R&D Infrastructure

At Fraunhofer ISE, we benefit from this infrastructure for our research and development activities:

 

Photovoltaic Modules

TestLab PV Modules

Measurements and tests for the design qualification and type approval of PV modules

 

Photovoltaic Modules

CalLab PV Modules

Our services range from the calibration of individual cells and modules to customer-specific tasks such as the calibration of bifacial modules.

Selected Research Projects

 

GEPARD

High-Throughput Production System and Process Technology for Crystalline Silicon Solar Modules

 

SOLAR-TRAIN

PV Module Life Time Forecast and Evaluation

 

MOSBIT

Development of Characterization Methodology for Modules and Systems Applying Bifacial PV Technology

 

Similar

Simulation and Testing of Mechanical Loading Situations for Innovative PV Applications and Modules

Current Publications on the Topic "Module Analysis and Reliability"